SK Hynix plans to double wafer capacity in next five years, group chairman says

TAIPEI, June 2 (Reuters) – The chairman of South Korea’s SK Group said on Tuesday its ​memory chip unit SK Hynix (000660.KS), opens new tab aims to double ‌wafer capacity over the next five years.
Chey Tae-won was speaking at the Computex conference in Taipei, where executives from some of ​the world’s top technology companies, including Nvidia (NVDA.O), opens new tab, are ​gathering.
Chey, who warned in March that a global chip ⁠wafer shortage was likely to persist until 2030, also ​said the company needs more partnerships in Taiwan, not ​just with TSMC (2330.TW), opens new tab, the world’s largest contract chipmaker.
He added that he hopes his company can be a major high-bandwidth memory (HBM) supplier for ​Nvidia’s Vera Rubin system.
Last week, SK Hynix topped $1 trillion ​in market value for the first time, joining rivals Samsung Electronics (005930.KS), opens new tab and Micron ‌Technology (MU.O), opens new tab ⁠in reaching the milestone on an AI-driven rally.
SK Hynix, Nvidia’s leading supplier of HBM chips, held a 58% share in the global HBM market in the first quarter, ​followed by ​Samsung and Micron, ⁠each with a 21% share, according to Counterpoint Research.
Chey’s comments come as some analysts ​say the AI boom is reshaping the ​traditionally ⁠cyclical memory industry.
Goldman Sachs raised its 2028 operating profit forecasts for SK Hynix and Samsung Electronics by 24% and ⁠23.3%, respectively, ​to 454 trillion won ($299.62 billion) ​and 610 trillion won, citing sustained AI-driven demand.

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